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A guide to design and packaging of high speed digital and microwave circuitry. Early chapters cover the physical properties of packaging, with emphasis on materials properties and assembly technology, and later chapters deal with high speed signal distribution from the perspective of digital transmission lines. Coverage includes signal behavior in high speed circuits, materials selection, manufacturing aspects, design verification, and performance evaluation, with a minimum of mathematics. Includes a glossary. -- Copyright © 1999 Book News, Inc., Portland, OR All rights reserved


Book Description
With the help of this expert guide, you can design and package the high-frequency circuitry crucial to the performance of todayÕs advanced electronic products, such as Pentium chips, HDTV, and mobile communications. This book fully explains approaches that include basic signal transmission theory, digital and microwave circuit design, and how these are integrated with the packaging and interconnection characteristics. YouÕll find detailed coverage of signal behavior in both high speed digital and microwave circuits, as well as crucial aspects of materials selection and manufacturing.


Book Info
Comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. Provides practical design guidelines plus information on the major issues of design and performance evaluation. DLC: Electronic packaging.


Card catalog description
This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. This state-of-the-art resource also provides you with practical design guidelines - plus information on the major issues of design verification and performance evaluation.


From the Back Cover
A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.


About the Author
Stephen G. Konsowski has 34 years of electronic packaging engineering experience. Retired from Westinghouse as an an advisory engineer, he is now associated with Technology Seminars, Inc. of Lutherville, Maryland. He is a founding member of the Intenrational Electronics Packaging Society (IEPS) and one of its former directors. Mr. Konsowski has authored many technical papers and articles on electronic packaging, including a chapter for the Second Edition of McGraw-HillÕs Handbook of Electronic Materials and Processes and Handbook of Packaging and Interconnection. Arden R. Helland is an advisory engineer at the Northrop Grumman CorporationÕs Electronic Sensors and Systems Division with over 35 years of experience in all phases of electrical design for advanced electronic systems. He is the author of the chapter on the reliability digital systems for the McGraw-Hill Computer Engineering Handbook.

FROM THE PUBLISHER

This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. This state-of-the-art resource also provides you with practical design guidelines - plus information on the major issues of design verification and performance evaluation.

SYNOPSIS

A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines—plus information on the major issues of design verification and perfomance evaluation.

FROM THE CRITICS

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